Techni3

  The signature of today’s advanced technology – whether it’s autonomous vehicles, 5G-enabled devices, sensors creating an internet of things, or home routers – is high-speed, high-volume data transfer in increasingly dense packages. It poses new and unprecedented signal interference and heat dissipation challenges for design engineers worldwide. New products operate at higher frequencies and use more powerful ICs/SOCs to facilitate enhanced data transfer and capabilities. Therefore, these electronics generate an even higher potential for a significant amount of electromagnetic signal interference. But EMI is only one part of the problem. More components make electronics more powerful, but also hotter, thus increasing the need for fast, reliable heat dissipation. Don’t forget about increasing needs for mechanical and environmental durability, space constraints, and lightweight designs. Enclosures are not just simple, aesthetic housing. They are functional, essential parts helpi...